Backing plates mount the sputtering target in the sputtering system, so their selection is critical. Process Materials manufactures standard and custom designs to suit your specific sputtering process.
Materials used include oxygen-free, high conductivity (OFHC) copper, molybdenum, titanium, aluminum (alloys) and stainless steel in different sizes, shapes and geometries. These materials ensure provide the Backing plates good electrical contact and good thermal heat conductivity in the proper applications.
