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Sputtering Target Materials

SPUTTERING TARGET MATERIALS

PVD materials used in sputtering targets Choosing the proper Sputtering Target Materials is as important as choosing the format. Process Materials has a wide variety of materials including precious and non-precious materials including pure elements, compounds and alloys in purities ranging from 99% to 99.9999% for both R&D and production of sputtering targets.

Impurities in a sputtering target can significantly affect the quality of the deposited thin film by causing issues like poor adhesion, non-uniformity, cracks, and electrical disruptions as even small amounts of contaminant particles can be incorporated into the film, degrading its desired properties; therefore, high-purity targets are crucial for producing high-quality coatings in sputtering processes.

When choosing materials, consider the following:
Properties: The material should have the properties you need for the thin film you want to create.
Purity: Impurities in the material can affect the properties of the thin film.
Size and shape: The target’s size and shape should be based on what you’re coating and the deposition system you’re using.

Metals

Material	Composition	Sputtering Target	Cylindrical Target	E-Beam	Evaporation	Typical Purity
Aluminum	Al	x	x	x	x	99.9%-99.9999%
Antimony	Sb	x		x	x	99.999%
Boron	B	x		x	x	99.95%
Barium	Ba	x			x	99.95%
Bismuth	Bi	x		x	x	99.9%-99.999%
Carbon/Graphite	C	x	x	x	x	99.999%
Cadmium	Cd	x		x	x	99.999%
Cerium	Ce	x			x	99.9%
Cobalt	Co	x		x	x	99.9%
Chromium	Cr	x	x	x	x	99.95%
Copper	Cu	x	x	x	x	99.99%-99.999%
Gallium	Ga				x	99.999%
Germanium	Ge	x		x	x	99.999%
Hafnium	Hf	x		x	x	99.9%-99.99%
Iron	Fe	x		x	x	99.9%-99.99%
Indium	ln	x	x	x	x	99.99%-99.999%
Lanthanum	La				x	99.9%
Lead	Pb	x		x	x	99.995%
Magnesium	Mg	x		x	x	99.95%
Manganese	Mn	x		x	x	99.9%
Molybdenum	Mo	x	x	x	x	99.95%
Niobium	Nb	x	x	x	x	99.95%
Nickel	Ni	x	x	x	x	99.7%-99.995%
Osmium	0s				x	99.9%
Scandium	Sc				x	99.9%
Selenium	Se	x		x	x	99.999%
Silicon	Si	x	x	x	x	99.999%
Strontium	Sr				x	99.5%
Tin	Sn	x	x	x	x	99.99%
Tantalum	Ta	x	x	x	x	99.95%-99.99%
Tellurium	Te	x		x	x	99.999%
Titanium	Ti	x	x	x	x	99.7%-99.995%
Tungsten	W	x	x	x	x	99.95%
Vanadium	V	x		x	x	99.9%
Yttrium	Y	x		x	x	99.9%
Ytterbium	Yb	x		x	x	99.9%
Zinc	Zn	x	x	x	x	99.99%-99.995%
Zirconium	Zr	x	x	x	x	99.7%
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Alloys

Material	Composition	Sputtering Target	Cylindrical Target	E-Beam	Evaporation	Typical Purity
Aluminum+Copper	Al+Cu	x		x	x	99.99%
Aluminum+Chromium	Al+Cr	x		x	x	99.9%-99.99%
Aluminum+Silicon	Al+Si	x	x	x	x	99%-99.999%
Aluminum+Titanium	Al+Ti	x		x	x	99.95%
Gold+Beryllium	Au+Be	x		x	x	99.99%
Gold+Copper	Au+Cu	x		x	x	99.99%
Gold+Germanium	Au+Ge	x		x	x	99.99%
Gold+Germanium+Nickel	Au+Ge+Ni	x		x	x	99.99%
Gold+Germanium+Antimony	Au+Ge+Sb	x		x	x	99.99%
Cobalt+Nickel	Co+Ni	x		x	x	99.95%
Gold+Nickel	Au+Ni	x		x	x	99.99%
Chromium+Silicon	Cr+Si	x		x	x	99.95%
CIGS	Cu(InGa)Se ₂	x	x	x	x	99.99%
Copper+Gallium	Cu+Ga	x	x	x	x	99.99%
Copper+Indium	Cu+In	x	x	x	x	99.99%
Copper+Nickel	Cu+Ni	x		x	x	99.99%
Copper+Selenium	Cu+Se	x		x	x	99.99%
Copper+Zinc	Cu+Zn	x		x	x	99.99%
Copper+Indium+Selenium	CulnSe ₂	x		x	x	99.99%
Iron+Hafnium	Fe+Hf	x		x	x	99.9%
Iron+Nickel	Fe+Ni	x		x	x	99.9%
Germanium+Antimony	Ge+Sb	x		x	x	99.9%
Germanium+Antimony+Tellurium	Ge+Sb+Te	x		x	x	99.9%
Germanium+Tellurium	Ge+Te	x		x	x	99.9%
Indium+Tin	In+Sn	x		x	x	99.99%
Indium+Selenium	In ₂Se ₃	x		x	x	99.99%
Nickel+Chromium	Ni+Cr	x	x	x	x	99.99%
Nickel+Platinum	Ni+Pt	x		x	x	99.95%
Nickel+Vanadium	Ni+V	x		x	x	99.95%
Palladium+Silver	Pd+Ag	x		x	x	99.9%
Silicon+Antimony+Tellurium	Si+Sb+Te	x		x	x	99.99%
Titanium+Aluminum	Ti+Al	x	x	x	x	99.9%
Titanium+Chromium	Ti+Cr	x		x	x	99.5%-99.99%
Titanium+Copper	Ti+Cu	x		x	x	99.5% -99.95%
Titanium+Nickel	Ti+Ni	x		x	x	99.9%
Titanium+Silicon	Ti+Si	x		x	x	99.9%
Titanium+Zirconium	TI+Zr	x		x	x	99.95%
Tungsten+Titanium	W+Ti	x		x	x	99.5%-99.9%
Yttrium Barium Copper Oxide	YBCO	x		x	x	99.9%
Zinc+Aluminum	Zn+Al	x		x	x	99.99%
Zinc+Selenium	Zn+Se	x		x	x	99.99%
Zinc+Tin	Zn+Sn	x	x	x	x	99.99%
Zirconium+Aluminum	Zr+Al	x		x	x	99.9%
Zirconium+Hafnium	Zr+Hf	x		x	x	99.9% -99.95%
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Precious Metals

Material	Composition	Sputtering Target	Cylindrical Target	E-Beam	Evaporation	Typical Purity
Gold	Au	x		x	x	99.99%-99.999%
Iridium	Ir	x		x	x	99.9%
Palladium	Pd	x		x	x	99.95%
Platinum	Pt	x		x	x	99.99%
Rhenium	Re	x		x	x	99.9%
Ruthenium	Ru	x		x	x	99.9%
Rhodium	Rh	x		x	x	99.9%
Silver	Ag	x	x	x	x	99.99%-99.999%
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Borides

Material	Composition	Sputtering Target	E-beam	Evaporation	Typical Purity
Aluminum Boride	AlB ₂	x	x	x	99%
Chromium Boride	CrB ₂	x	x	x	99.5%
Hafnium Boride	HfB ₂	x	x	x	99.5%
Lanthanum Boride	LaB ₆	x	x	x	99.5%
Molybdenum Boride	Mo ₂B ₅, MoB ₂	x	x	x	99.5%
Niobium Boride	NbB ₂	x	x	x	99.5%
Tantalum Boride	TaB ₂	x	x	x	99.5%
Titanium Boride	TiB ₂	x	x	x	99.5%
Tungsten Boride	WB, W ₂B	x	x	x	99.5%
Vanadium Boride	VB ₂	x	x	x	99.5%
Zirconium Boride	ZrB ₂	x	x	x	99.5%
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Carbides

Material	Composition	Sputtering Target	E-Beam	Evaporation	Typical Purity
Boron Carbide	B ₄C	x	x	x	99.5%
Chromium Carbide	Cr ₃C ₂	x	x	x	99.5%
Hafnium Carbide	HfC	x	x	x	99.5%
Molybdenum Carbide	MoC	x	x	x	99.5%
Niobium Carbide	NbC	x	x	x	99.5%
Silicon Carbide	SiC	x	x	x	99.5%
Tantalum Carbide	TaC	x	x	x	99.5%
Titanium Carbide	TiC	x	x	x	99.5%
Tungsten Carbide	WC	x	x	x	99.5%
Vanadium Carbide	VC	x	x	x	99.5%
Zirconium Carbide	ZrC	x	x	x	99.5%
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Fluorides

Material	Composition	Sputtering Target	E-Beam	Evaporation	Typical Purity
Aluminum Fluoride	AlF ₃	x	x	x	99.5%
Barium Fluoride	BaF ₂	x	x	x	99.9%
Calcium Fluoride	CaF ₂	x	x	x	99.9%
Lanthanum Fluoride	LaF ₃	x	x	x	99.9%
Lead Fluoride	PbF ₂	x	x	x	99.9%
Magnesium Fluoride	MgF ₂	x	x	x	99.9%
Sodium Fluoride	NaF	x	x	x	99.9%
Strontium Fluoride	SrF ₂	x	x	x	99.9%
Thorium Fluoride	ThF ₄	x	x	x	99.9%
Yttrium Fluoride	YF ₃	x	x	x	99%
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Nitrides

Material	Composition	Sputtering Target	E-Beam	Evaporation	Typical Purity
Aluminum Nitride	AlN	x	x	x	99.5%
Boron Nitride	BN	x	x	x	99.5%
Hafnium Nitride	HfN	x	x	x	99.5%
Silicon Nitride	Si ₃N ₄	x	x	x	99.9%
Tantalum Nitride	TaN	x	x	x	99.5%
Titanium Nitride	TiN	x	x	x	99.5%
Vanadium Nitride	VN	x	x	x	99.5%
Zirconium Nitride	ZrN	x	x	x	99.5%
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Oxides

Material	Composition	Sputtering Target	E-Beam	Evaporation	Typical Purity
Aluminum Oxide	Al ₂O ₃	x	x	x	99.99%
Antimony Oxide	Sb ₂O ₃	x	x	x	99.99%
Barium Titanate	BaTiO ₃	x	x	x	99.9%
Beryllium Oxide	BeO	x	x	x	99.5%
Bismuth Oxide	Bi ₂O ₃	x	x	x	99.9%
Bismuth Titanate	Bi ₄TiO ₃	x	x	x	99.9%
Cerium Oxide	CeO ₂	x	x	x	99.99%
Chromium Oxide	Cr ₂O ₃	x	x	x	99.9%
Gallium Oxide	Ga ₂O ₃	x	x	x	99.999%
Germanium Oxide	GeO ₂	x	x	x	99.999%
Hafnium Oxide	HfO ₂	x	x	x	99.9%
Indium Oxide	In ₂O ₃	x	x	x	99.99%
Indium Tin Oxide	(In ₂O ₃)90, (SnO ₂)10	x	x	x	99.99%
Iron Oxide	Fe ₂O ₃, Fe ₂O ₄	x	x	x	99.5%- 99.9%
Lead Titanate	PbTiO ₃	x	x	x	99.9%
Magnesium Oxide	MgO	x	x	x	99.95%
Manganese Oxide	MnO, MnO ₂, Mn ₂O ₃	x	x	x	99.9%
Molybdenum Oxide	MoO ₂, MoO ₃	x	x	x	99.9%
Neodymium Oxide	Nd ₂O ₃	x	x	x	99.9%
Nickel Oxide	NiO	x	x	x	99.9%
Niobium Oxide	Nb ₂O ₅	x	x	x	99.95%
Praseodymium Oxide	Pr ₂O ₃	x	x	x	99.9%
Samarium Oxide	Sm ₂O ₃	x	x	x	99.9%
Silicon Dioxide	SiO ₂	x	x	x	99.995%
Silicon Monoxide	SiO	x	x	x	99.9%
Strontium Oxide	SrO	x	x	x	99.5%
Strontium Titanate	SrTiO ₃	x	x	x	99.9%
Tantalum Oxide	Ta ₂O ₅	x	x	x	99.9%
Tin Oxide	SnO ₂	x	x	x	99.9%
Titanium Oxide	TiO ₂, Ti ₂O ₃	x	x	x	99.9%
Tungsten Oxide	WO ₃	x	x	x	99.9%
Yttrium Oxide	Y ₂O ₃	x	x	x	99.9%
Zinc Oxide	ZnO	x	x	x	99.99%
Zirconium Oxide	ZrO ₂	x	x	x	99.9%
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Selenides

Material	Composition	Sputtering Target	E-Beam	Evaporation	Typical Purity
Cadmium Selenide	CdSe	x	x	x	99.995%
Lead Selenide	PbSe	x	x	x	99.95%
Molybdenum Selenide	MoSe ₂	x	x	x	99.9%
Niobium Selenide	NbSe ₂	x	x	x	99.8%
Tantalum Selenide	TaSe	x	x	x	99.4%
Tungsten Selenide	WSe ₂	x	x	x	99.8%
Zinc Selenide	ZnSe	x	x	x	99.9%
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Silicides

Material	Composition	Sputtering Target	E-Beam	Evaporation	Typical Purity
Chromium Silicide	CrSi ₂, Cr ₃Si	x	x	x	99.5%
Cobalt Silicide	CiSi ₂	x	x	x	99.5%
Hafnium Silicide	HfSi ₂	x	x	x	99.5%
Iron Silicide	FeSi ₂	x	x	x	99.5%
Molybdenum Silicide	MoSi ₂	x	x	x	99.5%
Niobium Silicide	NbSi ₂	x	x	x	99.5%
Tantalum Silicide	TaSi ₂, TaSi ₃	x	x	x	99.5%
Titanium Silicide	Ti ₅Si ₂, TaSi ₃	x	x	x	99.9%
Tungsten Silicide	WSi ₂	x	x	x	99.9%
Vanadium Silicide	VSi ₂ , V ₃Si	x	x	x	99.5%
Zirconium Silicide	ZrSi 2 ₂	x	x	x	99.5%
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Sulfides

Material	Composition	Sputtering Target	E-Beam	Evaporation	Typical Purity
Cadmium Sulfide	CdS	x	x	x	99.99%
Indium sulfide	In ₂S ₃	x	x	x	99.99%
Lead Sulfide	PbS	x	x	x	99.9%
Molybdenum Sulfide	MoS ₂	x	x	x	99%
Tantalum Sulfide	TaS ₂	x	x	x	99.9%
Tungsten Sulfide	WS ₂	x	x	x	99.8%
Zinc Sulfide	ZnS	x	x	x	99.99%
Zirconium Sulfide	ZrS ₂	x	x	x	99.9%
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Tellurides

Material	Composition	Sputtering Target	E-Beam	Evaporation	Typical Purity
Cadmium Telluride	CdTe	x	x	x	99.99%
Lead Telluride	PbTe	x	x	x	99.99%
Molybdenum Telluride	MoTe ₂	x	x	x	99.9%
Niobium Telluride	NbTe ₂	x	x	x	99.8%
Tantalum Telluride	TaTe ₂	x	x	x	99.8%
Tungsten Telluride	WTe ₂	x	x	x	99.8%
Zinc Telluride	ZnTe	x	x	x	99.99%
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