Process Materials provides sputtering target bonding and reclamation services as a single source option or as part of a complete turn key solution for PVD.

Process Materials, Inc. offers professional and diverse range of sputtering target bonding services. Our bonding process ensures the thermal and electrical integrity of the interface between the system’s cooling assembly and the surface of the target. We can bond sputtering targets of any shape and material due to our proprietary solder metallization technology. Our process includes wetting, barrier interface, and adhesion. Process Materials provides epoxy, elastomer, and indium bonding.

As a complete solution, Process Materials will recycle sputtering targets, whether they were originally purchased from us or from other suppliers. We will recycle certain materials based on current market values.

With a rapid turnaround, each target is analyzed and recycled or refined using appropriate techniques. Backing plates can be returned to the customer or stored, refurbished and reused for future orders. With our commitment to environmental stewardship, we adhere to all governmental disposal regulations.  To lower your cost of ownership, we will work with you to determine the best credit option.