Process Materials, Inc offers professional and diverse bonding services. Our bonding process ensures the thermal and electrical integrity of the interface between the system’s cooling assembly and the surface of the sputter target. We can bond targets of any shape and material due to our proprietary solder metallization technology. Our process includes wetting, barrier interface and adhesion.
Process Materials has developed a sophisticated and reliable bonding method. Thin film adhesion, diffusion barrier, and metallization are sputtered to the back of each sputtering target followed by a temperature controlled metallic solder seal between the target and the backing plate.
Process Materials provides epoxy, elastomer, and indium bonding. Call for more information.