Planar Sputtering Targets

Planar Sputtering Targets

Our production/manufacturing capabilities range from prototyping to full production range.  Melting/casting, rolling, sintering, hot pressing, and vacuum-induction melting are part of our most advanced manufacturing/production processes to give you the highest quality product available.  Whether your material is a single piece or multi-tiled construction, bonded, bolted, or clamped, rectangular, triangular, circular, or ring-shaped, pure metal, alloy, or ceramic, Process Materials is your solution for high quality sputtering target materials and workmanship.


Process Materials carries high standards on all products.  We offer a variety of materials ranging from basic metals to high refractive ceramics.  You can purchase a range of targets from small diameter R&D targets to large-scale multi-tile designs.

We offer monolithic targets, small and large diameter design, multi-piece tile sets and custom designed target assemblies

Cylindrical Sputtering Targets

Cylindrical Sputtering Targets

Process Materials supplies a wide variety of different sized sputter targets for all major PVD sputtering systems. Manufacturing technologies for this application include casting, plasma spraying, arc spraying, wire flame spraying and pressing-sintering. Rotatable target lengths up to 4000mm, magnetron-specific end block, spray layer of dog-bone, surface finished or unfinished, new targets with or without backing tube or removal of “spent” material and applying a new layer. Metals, alloys, ceramic and precious metal sputtering targets are standard products.


Process Materials carries exceptionally high standards on all products.  To assist our customers with proper handling of target tubes, we recommend the following:

Target storage:

  • Keep a new sputtering target in its original packaging until it is used
  • If a used target needs to be stored again, it must be re-wrapped in protective paper, foil, or foam
  • The target must be stored in its original crate (supported on both ends and in the middle) and placed in dry and dust-free environment

Target Handling:

  • Never touch a sputter target surface with bare hands. Targets must be handled with plastic gloves to avoid contamination of the target surface and subsequent problems during sputtering
  • Before lifting with a crane or handling in any way, the sputtering target must be wrapped in protective paper and a layer of foam
  • The target surface must be kept clean at all times and free of dust, water, and grease

Precautions Under Vacuum:

  • When the sputter target is mounted and operation in a substantially horizontal position in the coater, it is preferred to engage cooling water to the target and sustain target rotation to prevent sagging or deformation of the tube
  • When a heating source is applied in the coater, it is necessary to engage cooling water to the target and sustain target rotation before the heaters are being activated.  This will prevent non-uniform thermal loading
  • Only after switch-off of the heaters and sufficient time to allow cooling of the system, rotation of the target may be stopped and the cooling water valve of the target may be closed

External Product Specification Example - Si Sputter Target

Production Methodology:

The target material is thermally sprayed and receives a surface finish. An adhesion-promoting layer is present on the stainless steel backing tube (SS 304). After quality control, the targets are wrapped in protective paper or foam, packed with silica gel in PVC bages and fixed in wooden crates for shipping.

Analytical Methods:

ICP/AAS analyzes chemical composition

ICP analyzes impurity levels

O/N element analyzer measures O/N levels

Balance with water vessel measures density

Metallographic analyzes microscopy


Surface Finish and Appearance at Shipment:

  • No cracks visible to the naked eye
  • Visible inclusions and/or hole (<0.1mm = acceptable; 0.1-0.5 = 5 in a 10mm annular ring; >0.5mm = unacceptable)
Backing Plates

Backing Plates

Process Materials manufactures standard and custom backing plates to suit your specific sputtering processes.


The selection of an appropriate backing plate is critical as it is used to mount the target in the sputtering system. We offer backing plate materials such as oxygen-free, high conductivity copper (OFHC), molybdenum, titanium, aluminum (alloys) and stainless steel in different sizes, shapes and geometries.

Custom backing plates include copper, titanium, molybdenum, and stainless steel

Bonding Services

Bonding Services

Process Materials, Inc offers professional and diverse bonding services. Our bonding process ensures the thermal and electrical integrity of the interface between the system’s cooling assembly and the surface of the sputter target. We can bond targets of any shape and material due to our proprietary solder metallization technology. Our process includes wetting, barrier interface and adhesion.


Process Materials has developed a sophisticated and reliable bonding method.  Thin film adhesion, diffusion barrier, and metallization are sputtered to the back of each sputtering target followed by a temperature controlled metallic solder seal between the target and the backing plate.

Process Materials provides epoxy, elastomer, and indium bonding.  Call for more information.

Precious Metals

Precious Metals

Process Materials offers a comprehensive array of high purity precious metal thin film deposition products.

  • Sputtering Targets - single or multi-tiles
  • Evaporation Material - slugs or pellets
  • Crucible liners


Along with the fabrication of slugs, pellets, crucibles, or targets, Process Materials will reclaim and recover your spent targets and other process-related scrap quickly and efficiently.  We can provide credit for new product or send a check directly to your company.

Process Materials, Inc. is a one-stop, full-service solution for all your precious metal requirements.

Our design capabilities ensure the most efficient use of your precious metals.

We are able to work with the following precious metals:

  • Gold
  • Silver
  • Platinum
  • Ruthenium
  • Iridium
  • Palladium
  • Rhodium