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Backing Plates

Backing Plates

Process Materials manufactures standard and custom backing plates to suit your specific sputtering processes.


The selection of an appropriate backing plate is critical as it is used to mount the target in the sputtering system. We offer backing plate materials such as oxygen-free, high conductivity copper (OFHC), molybdenum, titanium, aluminum (alloys) and stainless steel in different sizes, shapes and geometries.

Custom backing plates include copper, titanium, molybdenum, and stainless steel